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sunbin/电子签章 电子合同工具版

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MIT
MIT License Copyright (c) 2023 kaifangqian Permission is hereby granted, free of charge, to any person obtaining a copy of this software and associated documentation files (the "Software"), to deal in the Software without restriction, including without limitation the rights to use, copy, modify, merge, publish, distribute, sublicense, and/or sell copies of the Software, and to permit persons to whom the Software is furnished to do so, subject to the following conditions: The above copyright notice and this permission notice shall be included in all copies or substantial portions of the Software. THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM, OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE SOFTWARE.

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开放签电子签章/电子合同开源工具版源代码,整体电子签能力包括:数字证书生成、手写面板、公章生成、在线签署(关键字签署/骑缝章签署/坐标签署)、签署空间拖拽、PDF转图片、验签等。DEMO可以简单模拟电子签应用功能。SDK便于Java开发者快速应用电子证书颁发、电子签章、电子文件签署功能。API提供跨平台、跨语言能力,让不同语言工程快速应用。 展开 收起
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